Name: Maszyna do polerowania mechaniczno-chemicznego
Contact person: Dr inż. Grzegorz Kamler
Laboratory: NL-3
Location: ul. Sokołowska 29/37 Warszawa

Research capabilities and technical data

CMP (Chemical Mechanical Polishing) machines developed at IWC PAS, designed for polishing GaN and other single crystals up to 2 inches in diameter, enabling the achievement of atomically smooth surfaces.

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